HKIE Transactions – Manuscript submission and Subscription
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HKIE Transactions (ISSN 1023-697X) is a quarterly periodical of the Institution with over 20 years of history, which provides a forum for discussing all aspects of engineering from both theoretical and practical perspectives. The journal is indexed in Scopus (https://www.scopus.com/sourceid/29753) and EI (https://www.elsevier.com/solutions/engineering-village/content/compendex). State-of-the-art papers, research paper, literature review, case history, technical note/letter and written discussion are welcome.
An online submission system, ScholarOne Manuscripts was set up to facilitate the paper submission, peer review process and extend our reach to international authors. The Editorial policy remains under the exclusive control of the Editorial Panel. For more details regarding the author guidelines, please refer to the Instructions for Authors and Referencing Style.
Manuscript submission
To submit to HKIE Transactions, please go to the ScholarOne Manuscripts platform at http://mc.manuscriptcentral.com/thie.
Subscription
Special subscription rate of HK$120 per annum (4 issues) is offered to members. To subscribe, please complete the Subscription Form and email us at hkietransactions@hkie.org.hk
Members' benefits
In addition to receiving the printed copies of the journal, all subscribing members to HKIE Transactions can enjoy free online access to the archive of recent issues of HKIE Transactions from the Member Login area of the HKIE website. Members who have subscribed please visit (link of online archive) for abstracts and full-length articles of HKIE Transactions.
EDITORIAL PANEL
EDITOR-IN-CHIEF:
Ir Prof CHAN Tat Leung, The Hong Kong Polytechnic University, Hong Kong
EDITORS:
Ir Dr CHENG Yung Ming, The Hong Kong Polytechnic University, Hong Kong
Ir Prof Benny C F CHEUNG, The Hong Kong Polytechnic University, Hong Kong
Ir Dr Frank H F LEUNG, The Hong Kong Polytechnic University, Hong Kong
Ir Prof Michael K H LEUNG, City University of Hong Kong, Hong Kong
Ir Prof Daniel S H LO, The University of Hong Kong, Hong Kong
Ir Dr TSANG Kim Fung, City University of Hong Kong, Hong Kong
ASSOCIATE EDITORS:
Dr CHAN Tak Ming, The Hong Kong Polytechnic University, Hong Kong
Ir Prof CHEN Shihchi, The Chinese University of Hong Kong, Hong Kong
Dr Benard C Y CHIU, City University of Hong Kong, Hong Kong
Dr DENG Xiaowei, The University of Hong Kong, Hong Kong
Dr Ivan W H FUNG, City University of Hong Kong, Hong Kong
Dr Ivan W H HO, The Hong Kong Polytechnic University, Hong Kong
Dr Jerry J HU, The Hong Kong Polytechnic University, Hong Kong
Ir Prof George G Q HUANG, The University of Hong Kong, Hong Kong
Ir Prof LEE Yi Kuen, The Hong Kong University of Science and Technology, Hong Kong
Dr Steve LING, University of Technology Sydney, Australia
Dr LIU Chun Ho, The University of Hong Kong, Hong Kong
Ir Dr NG Pui Lam, The University of Hong Kong, Hong Kong
Ir Dr NING Zhi, The Hong Kong University of Science and Technology, Hong Kong
Prof TANG Shiu Keung, The Hong Kong Polytechnic University, Hong Kong
Dr William W WEI, Ove Arup & Partners (HK) Ltd, Hong Kong
Ir Prof Alan W G WONG, Technological and Higher Education Institute of Hong Kong, Hong Kong
Prof Bruno Bogaz ZARPELAO, State University of Londrina, Brazil
Prof ZHOU Junwei, Wuhan University of Technology, China
TRANSACTIONS INTERNATIONAL ADVISORS:
Ir Dr Tommy H T CHAN, Queensland University of Technology, Australia
Prof Leo CHIN, Western Sydney University, Australia
Prof FU Song, Tsinghua University, China
Dr Andy P K HONG, The University of Utah, USA
Dr HUI Yu, University of Portsmouth, UK
Dr LAM Hak Keung, King’s College London, UK
Prof LI Kai Ming, Purdue University, USA
Prof LI Shu Jun, University of Kent, UK
Prof M RAJARAJAN, City University London, UK
Prof TSAI Keh-chyuan, National Taiwan University, Taiwan
Prof Henry K K WONG, Université de Lyon, France