HKIE Transactions

HKIE Transactions – Manuscript submission and Subscription 

 

Self Photos / Files - HKIE-Cover_Option-1_rHKIE Transactions (ISSN 1023-697X) is the international journal of the Institution with over 20 years of history, which contains papers on all aspects of engineering, which are of use and interest to practising engineers and academics alike. It contains state-of-the-art papers, case histories, literature reviews, research papers, technical notes/letters and written discussions. The journal welcomes Transactions papers, Technical Notes/Letters on all aspects of engineering. Good quality practical papers are as welcome as those of an academic nature.

The journal is indexed in Scopus, ICI Journals Master List database for 2019 and by the Polish Ministry of Science and Higher Education.

 

An online submission system, ScholarOne Manuscripts is used to facilitate the paper submission, peer review process and extend our reach to international authors. The Editorial policy remains under the exclusive control of the Editorial Panel. For more details regarding the author guidelines, please refer to the Instructions for Authors and Referencing Style.

 

Manuscript submission


To submit to HKIE Transactions, please go to the ScholarOne Manuscripts platform.

 


HKIE Transactions Online: A Paperless Reading Experience, anytime, anywhere and for everyone

To encourage the transfer of engineering knowledge, HKIE Transactions is now paper-free and subscription-free. Both HKIE members and non-members are welcome to enjoy free online access to the HKIE Transactions archive anytime and anywhere on the go! Do not miss this opportunity to enjoy a better reading experience at HKIE Transactions Online!

 

What’s New

 

- Call for Papers: HKIE Transactions Theme Issue on AI for Smart Applications

 

- Free public access of the awarded papers of The HKIE Outstanding Paper Award for Young Engineers/Researchers 2019 and the HKIE Best Transactions Paper Prize 2019 

 

EDITORIAL PANEL

 

EDITOR-IN-CHIEF: Ir Prof CHAN Tat Leung 
The Hong Kong Polytechnic University, Hong Kong
   
EDITORS:

Ir Dr CHENG Yung Ming 
The Hong Kong Polytechnic University, Hong Kong

Ir Prof Benny C F CHEUNG
The Hong Kong Polytechnic University, Hong Kong

Ir Dr Frank H F LEUNG 
The Hong Kong Polytechnic University, Hong Kong

Ir Prof Michael K H LEUNG 
City University of Hong Kong, Hong Kong

Ir Prof Daniel S H LO 
The University of Hong Kong, Hong Kong

Ir Dr TSANG Kim Fung 
City University of Hong Kong, Hong Kong

   
ASSOCIATE EDITORS:

Dr CHAN Tak Ming
The Hong Kong Polytechnic University, Hong Kong

Ir Prof CHEN Shihchi
The Chinese University of Hong Kong, Hong Kong

Dr Benard C Y CHIU
City University of Hong Kong, Hong Kong

Dr DENG Xiaowei
The University of Hong Kong, Hong Kong

Dr FENG Shien Ping
The University of Hong Kong, Hong Kong

Dr Ivan W H FUNG
City University of Hong Kong, Hong Kong

Dr Ivan W H HO
The Hong Kong Polytechnic University, Hong Kong

Dr Jerry J HU
The Hong Kong Polytechnic University, Hong Kong

Ir Prof George G Q HUANG
The University of Hong Kong, Hong Kong

Dr Steve LING
University of Technology Sydney, Australia

Dr LIU Chun Ho
The University of Hong Kong, Hong Kong

Ir Dr NG Pui Lam
The University of Hong Kong, Hong Kong

Dr Edwin C Y TSO
City University of Hong Kong, Hong Kong

Dr William W WEI
Ove Arup & Partners (HK) Ltd, Hong Kong

Ir Prof Alan W G WONG
Technological and Higher Education Institute of Hong Kong, Hong Kong

Prof Bruno Bogaz ZARPELAO
State University of Londrina, Brazil

Prof ZHANG Kaili
City University of Hong Kong, Hong Kong

Prof ZHOU Junwei
Wuhan University of Technology, China

   
TRANSACTIONS INTERNATIONAL ADVISORS:

Prof Kai CHENG 

Brunel University, UK
Prof Leo CHIN 

Western Sydney University, Australia
Prof Armando Walter COLOMBO 

University of Applied Sciences Emden/Leer, Germany
Prof HUANG Han 

The University of Queensland, Australia
Prof HUI Yu 

University of Portsmouth, UK
Prof Xi JIANG 

Queen Mary University of London, UK
Dr LAM Hak Keung 

King’s College London, UK

Prof Tim Tapani LÄNSIVAARA 

Tampere University, Finland

Prof LEE Chi King

The University of New South Wales, Australia

Prof LI Shu Jun 

University of Kent, UK

Prof TAN Kang Hai

Nanyang Technological University, Singapore

Prof Henry K K WONG 

Université de Lyon, France
Prof Jin XUAN 

Loughborough University, UK

 

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